Laser Cutter

MPI Laser Cutter System LCS-635

The unique MPI Laser Cutter System LCS-635 is designed for accurate and reliable Failure Analysis and Design Validation applications. Variable configurations based on 1064 nm, 532 nm, 355 nm or 266 nm wavelengths provides the capability to remove several semiconductor materials and metals selectively, see below the table.

 

 

Wavelength - Application Matrix

  1064 mm 532 mm 355 / 266 mm
LCD Materials

ITO

Chromium

Color Filter

(Red / Green)

ITO

Chromium

Color Filter

(Blue / Green)

Color Filter

(Blue / Green)

Semiconductor Materials N/A

Silicon Dioxide

Nitride Polyimide (big cuts)

SOG Poly-silicon

Nitride Polyimide
Metals

Gold

Aluminium

Tungsten

Gold

Aluminium

Tungsten

Gold

Aluminium

 

MPI Optics – Application Matrix

Microscope* 1064 nm 532 nm 325 nm 266 nm
FS70L Yes Yes Yes Not Recommended
FS70L4 Yes Yes Yes Yes
PSM1000 Yes Yes Not Recommended Not Recommended
VIS-200 Yes Yes Yes Not Recommended

* Other laser cutter compatible microscopes, on requests

 

High Beam Quality – Low Energy Consumption

The MPI Laser Cutter System is based on compact Diode Pump Solid State Laser, providing high beam quality, even at 266 nm, with enhanced pulse-to-pulse stability, and these by the unsurpassed low energy consumption.

Intuitive Operation

Designing the SMART Controller with intuitive, touch-screen graphical user interface, four free-defined function buttons for fast, direct access, the six user cutting recipes, are making the daily operation of the Laser Cutter System very convenient and easy.

Long Lifetime – Low Maintenance

The LCS-635 has more than 150x times longer lifetime as other conventional available laser systems on the market, and the passive, conductive laser head cooling, which eliminates the need for water, are making the system very reliable and reducing significantly the maintenance costs.

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